E-Newsletter 7 December , 2020 |
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HORUS430-X3 GPU-Accelerated Computer Perfects for Compute-Hungry Defense Applications
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As the leading provider of AI Inference GPU System, 7Starlake proudly launches HORUS430-X3 to meets growing market demand for NVIDIA GPU-accelerated compute in AI applications. HORUS430-X3 is combined with stunning inference performance, powerful Intel 9th Gen Xeon®/Core™ up to 6 cores and expansion capability. Besides, it’s also a SWaP-optimized 2U Rack-Mount GPGPU, which is the perfect ruggedized platform for versatile edge AI applications.
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- Intel® 9th Coffee-Lake i7-9850HE (2.7 GHz, up to 4.4 GHz, 6-cores, 12 threads)
- NVIDIA MXM Graphic Engine support up to GTX1080(CUDA2560,8 GB GDDR5X)
- NVIDIA MXM Support Up to 180W
- Dual 10 GbE SFP+
- DDR4 Up to 64GB (ECC for Options)
- 2 x LAN, 4 x USB, 2 x DVI
- Rugged MIL-DTL-38999 connectors
- MIL-STD-461/1275 18V-36V DC-Input
- Operating Temperature -20°C to +55°C
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HORUS430-X3 is designed to fulfill demands of mission critical applications. Apart from standard I/O interface, HORUS430-X3 equipped with 4 x LAN, 4 x USB, 2 x Display Ports. With these rich interfaces, HORUS430-X3 can be easily applied to targeting & acquisition system to link with diversified sensors, such as thermal image camera, scanned array radar…etc. |
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10-Gigabit Ethernet Solutions for the Next-Gen Military Platforms |
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This dual-port 10GbE network interface is optimized on HORUS430-X3 for server connectivity and network virtualization. It is designed to provide broad interoperability, critical performance optimizations, increased agility and multiple workloads for High Performance Computing (HPC), database clusters, clouds, as well as IT network solutions. |
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MIL-STD-461, MIL-STD-810G |
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HORUS430-X3 is designed to meet strict size, weight, and power (SWaP) requirements and to withstand harsh environments, including temperature extremes, shock/vibe, sand/dust, and salt/fog. HORUS430-X3 is MIL-STD-461/1275 EMI/EMC and MIL-STD-810 compliant rugged Edge AI Inference server. It passes numerous environmental tests including Temperature, Altitude, Shock, Vibration, Voltage Spikes, Electrostatic Discharge and more. The sealed compact chassis shields circuit cards from external environmental conditions such as sand, dust, and humidity. |
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